Technical Papers, Articles and Presentations

Process Integration of iALD TaN for Advanced Cu Interconnects June 2011
Copper Electroplating Approaches for 16 nm Technology May 2010
Low Resistance Wiring and 2Xnm Void Free Fill with CVD Ruthenium Liner and Direct Seed Copper May 2010
A Comprehensive Look at PVD Scaling to Meet the Reliability Requirements of Advanced Technology Aug 2009
Electromigration Improvement for Advanced Technology Nodes March 2009
Optical pump-probe measurements of sound velocity and thermal conductivity of hydrogenated amorphous carbon films Aug 2008
Cu/low k Interconnect Technologies for 32nm and Beyond May 2008
Applications of Chemical Engineering Principles to Thin Film Deposition Process Development May 2008

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