Technical Papers, Articles and Presentations

Copper Electroplating Approaches for 16 nm Technology May 2010
A Comprehensive Look at PVD Scaling to Meet the Reliability Requirements of Advanced Technology Aug 2009
Electromigration Improvement for Advanced Technology Nodes March 2009
Optical pump-probe measurements of sound velocity and thermal conductivity of hydrogenated amorphous carbon films Aug 2008
Cu/low k Interconnect Technologies for 32nm and Beyond May 2008
Applications of Chemical Engineering Principles to Thin Film Deposition Process Development May 2008
Reliability at the heart of scaling: Challenges and emerging solutions for 32 and 22 nm technology April 2008
PDL™ Oxide Enabled Pitch Doubling Feb 2008

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